On June 30, 2021, Sun, Guanqing; Wu, Xingyi; Liu, Ren published an article.Computed Properties of 2358-84-1 The title of the article was A comprehensive investigation of acrylates photopolymerization shrinkage stress from micro and macro perspectives by real time MIR-photo-rheology. And the article contained the following:
The acrylate photocuring system with the high curing rate are widely used in various industries. However, the rapid polymerization kinetics can cause the surge of resin viscosity and the gel point can be reached in advance. This can results in the restriction of mol. chain movement and internal stress release is thus hindered during the photopolymerization Finally, it usually leads to the poor performance of UV-cured materials with lower double bond conversion and large volume shrinkage and shrinkage stress. In order to understand the relationship between properties and polymerization process, this paper employed the combined technique of the mid-IR spectrometer and photo-rheometer to monitor the acrylate free radical photopolymerization process. The effects of curing conditions (curing temperature, radiant intensity and sample thickness) and system compositions (diluent functionality, diluent segment length) on the rheol. properties and chem. conversion of materials were fully investigated. Finally, a standard protocol is established to evaluate the reactivity, mech. properties and volume shrinkage of the photocuring system. Simultaneously, the double bond conversion of the reaction system can be achieved through calculation of peak area of IR absorption. A complex nonlinear relationship between the storage modulus, shrinkage stress and double bond conversion is established. The experimental process involved the reaction of Oxybis(ethane-2,1-diyl) bis(2-methylacrylate)(cas: 2358-84-1).Computed Properties of 2358-84-1
The Article related to acrylate photopolymerization shrinkage stress rheol property, Coatings, Inks, and Related Products: Epoxy Resin Coatings and other aspects.Computed Properties of 2358-84-1
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